Reliability Test System
| NO | Test Type | Test Name | Following Standard | Analysis Item | Download |
| 1 | Electric Properties | Voltage Measuring Device | IPC-TM-650 2.5.7 | Dielectric Withstanding Voltage Test | |
| 2 | High Resistance Meter | IPC-TM-650 2.6.3 | Insulation Resistance Test | ||
| 3 | TDR Test | NA | PCB Impedance Test | ||
| 4 | SIR Test | IPC-TM- 650 2.6.3.3A & IPC-TM-650 2.6.3E& IPC-TM-650 2.6.14A | Surface Insulation Resistance, Humidity Insulation Resistance Test, Iron Migration test | ||
| 5 | Mechanical Properties | Peeling Test Instrument | IPC-TM-650 2.4.8.C | Peel Strength Test |  銅箔/鍍銅剝離強度測試 1 file(s) 73.86 KB
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| 6 | S/M adhesion tape | IPC-TM-650 2.4.28. & IPC-6012A 3.8.2 | Adhesion Test | ||
| 7 | Chemical Properties | Cleanness Test Instrument | IPC-TM-650 2.3.25B | Ionic Contamination Test | |
| 8 | Thermal Properties | Thermal Shock Instrument | IPC-TM-650 2.6.7.2 | Copper Plating Quality Test | |
| 9 | High Temperature & Humidity Cycle Instrument | IPC-TM-650 2.6.7.2 IPC-6012A 3.11.8 | Aging Test | ||
| 10 | IST (Interconnect Stress Testing) | IPC-TM-650 2.6.26 | DC Current Induced Thermal Cycling Test | ||
| 11 | Solderability | Solderability Test | IPC-TM-650 2.3.25B | PCB Solderability Test | |
| 12 | Thermal Stress Test | IPC-TM-650 2.6.8 | Quality of Plated-Through Holes Test | ||
| 13 | Else | SEM&EDX | N/A | Scanning and Element Analysis | |
| 14 | DSC (Difference Scanning Calorimeter) | IPC-TM 650 2.4.25 | Glass Transition Temperature (Tg and △Tg) |
