Multi-Layer Board

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Character		2011
Capability(Regular)		4~12	2~14
Thickness		1.2~1.6mm	0.8~1.6mm
Material	FR4	Tg150/Tg170 Tg150 HF/Tg170 HF	Tg150/Tg170 Tg150 HF/Tg170 HF
	Min Core	4mil	3mil
	Max Core	62mil	62mil
Copper	Internal	1/2oz,1oz	1/2oz,1oz,2oz(P/G only)
	External	1/2oz	1/2oz,1oz
Pattern	Min L/S	4mil/4mil	3mil/3mil
VIA	Min Hole	10mil	8mil
	Min Pad	20mil	16mil
	Aspect Ratio	5	6
	Min Ring	5mil	4mil
Solder Mask	Color	Green/Blue	Green/Blue Red/Yellow/Black
	Min Web	3mil	2.5mil/6mil(Black)
	Min Clearance	2.5mil	1.5mil
	Min Coverage	3.5mil	2.5mil
Legend	Color	White	White/Yellow/Black
	Min Width	6mil	4mil/6mil(Black)
Matel Finished		OSP/Immersion Silver ENIG/ENIG+OSP Hard Gold Plating	OSP/Immersion Silver ENIG/ENIG+OSP Hard Gold Plating
Registration (Min Space between PTH & Pattern)		8mil	7mil
Tolerance	Impedance	±10%	±10%
	Dimention	±5mil	±5mil
	Hole	PTH±3mil/NPTH±2mil	PTH±2mil/NPTH±2mil

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Character		2011
Capability(HLC-High Layer Count)		Normal	Limit
Layer Count		6~14	6~18
Thickness		1.2~2.4mm	1.0~3.2mm
Material	FR-4	Tg150/Tg170 Tg150 HF/Tg170 HF	Tg150/Tg170 Tg150 HF/Tg170 HF Low Dk(Df)
	Min Core	4mil	3mil
	Max Core	47mil	47mil
Copper	Internal	1/2oz,1oz,2oz(P/G only)	1/2oz,1oz,2oz
	External	1/2oz,1oz	1/2oz,1oz
Pattern	Min L/S	4mil/4mil	3mil/3mil
VIA	Min Hole	10mil	8mil
	Min Pad	20mil	18mil
	Aspect Ratio	6	10
	Min Ring	5mil	5mil
Solder Mask	Color	Green/Blue	Green/Blue Red/Yellow/Black
	Min Web	3mil	2.5mil/6mil(Black)
	Min Clearance	2.5mil	2mil
	Min Coverage	3.5mil	3mil
Legend	Color	White	White/Yellow/Black
	Min Width	6mil	4mil/6mil(Black)
Matel Finished		OSP/Immersion Silver ENIG/ENIG+OSP Hard Gold Plating	OSP/Immersion Silver ENIG/ENIG+OSP Hard Gold Plating LF HASL
Registration (Min Space between PTH & Pattern)		8mil	6mil
Registration For Reliability (Min Space between PTH & Pattern)		10mil	8mil
Tolerance	Impedance	±10%	±8%
	Dimention	±5mil	±5mil
	Hole	PTH±3mil/NPTH±2mil	PTH±2mil/NPTH±2mil