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		 Product Information產品資訊 Product Information產品資訊
產品資訊
發展方向及製程能力
多層印刷電路板
高密度互連印刷電路板
多層印刷電路板
| Character | |||
|---|---|---|---|
| Capability(Regular) | Normal(MASS) | Limit(Sample) | |
| Thickness | 0.5mm~2.5mm | 0.4~4.0mm | |
| Material | FR4 | Normal TG:NanYa、Sheng Yi、KingBoard H-TG:NanYa、EMC、Grace | Low loss :NanYa、TUC、ITEQ、EMC、Sheng Yi | 
| HF:NanYa、Sheng Yi、TUC、EMC Low CTE:NanYa、Sheng Yi、KingBoard、NOUYA | |||
| Mid-Loss:NanYa、TUC、ITEQ、EMC、Sheng Yi | |||
| Min Core | 3mil | 2.5mil | |
| Max Core | 88mil | 126mil | |
| Copper | Internal | Hoz、1oz、2oz、3oz | Hoz、1oz、2oz、3oz、4oz | 
| External | 1/3oz、Joz、Hoz、1oz、2oz | 1/3oz、Joz、Hoz、1oz、2oz、3oz | |
| Pattern | Min L/S | 3mil/3mil | 2.5mil/3mil | 
| VIA | Min Hole | 8mil | 8mil | 
| Min Pad | 18mil | 16mil | |
| Aspect Ratio | 8 | 10 | |
| Min Ring | 5mil | 4mil | |
| Solder Mask | Color | Green、Bule、White、Black | Green、Bule、White、Black、Red、Yellow、Brown | 
| Min Web | Green、Bule、White:3mil Black:4mil | Green、Bule、White、Red、Yellow:2.5mil Black:3.5mil Brown:6mil | |
| Min Clearance | 2mil | 1.5mil | |
| Min Coverage | Green、Bule、White:2.5mil Black:3mil | Green、Bule、White、Red、Yellow:2mil Black、Brown:2.5mil | |
| Legend | Color | White、Yellow、Black | White、Yellow、Black | 
| Min Width | 4mil | 4mil | |
| Matel Finished | OSP、IMAG、ENIG、ENIG+OSP、 Hard Gold、Carbon INK | OSP、IMAG、ENIG、ENIG+OSP、 Hard Gold、Carbon INK | |
| Registration (Min Space between PTH & Pattern) | ≥10L:8mil <10L:6mil | ≥10L:6.5mil <10L:5.5mil | |
| Tolerance | Impedance | ±10% | ±8% | 
| Dimention | ±5mil | ±4mil | |
| Hole | PTH:±3mil NPTH:±2mil | PTH:±2mil NPTH:±1.5mil | |
| Character | |||
|---|---|---|---|
| Capability(HLC-High Layer Count) | Normal(MASS) | Limit(Sample) | |
| Layer Count | 4~16L | 4~22L | |
| Thickness | 0.6~2.4mm | 0.6~3.2mm | |
| Material | FR-4 | Std-loss.Mid-loss Low-loss (Mid-Tg/Hi-Tg/HF) | Std-loss.Mid-loss Low-loss.Very-loss.Ultra-low loss (Mid-Tg/Hi-Tg/HF) | 
| Min Core | 3mil | 2.5mil | |
| Max Core | 78mil | 126mil | |
| Copper | Internal | Hoz,1oz,2oz,3oz | Hoz,1oz,2oz,3oz,4oz | 
| External | Hoz,1oz,2oz | 1/3oz,Hoz,1oz,2oz,3oz | |
| Pattern | Min L/S | 3mil/3mil | 2.5mil/2.5mil | 
| VIA | Min Hole | 8mil | 8mil | 
| Min Pad | 18mil | 16mil | |
| Aspect Ratio | 8 | 12 | |
| Min Ring | 5mil | 4mil | |
| Solder Mask | Color | Green、Bule、Red、Yellow、Black | Custom | 
| Min Web | 3mil/4mil(Black) | 2.5mil/3mil(Black) | |
| Min Clearance | 2mil | 1.5mil | |
| Min Coverage | 2.2mil/2.7mil(Black) | 2.0mil/2.5mil(Black) | |
| Legend | Color | White | White、Yellow、Black | 
| Min Width | 4mil/6mil(Black) | 4mil/5mil(Black) | |
| Matel Finished | OSP、IMAG、ENIG、ENIG+OSP、 Hard Gold、Carbon INK | OSP、IMAG、ENIG、ENIG+OSP、 Hard Gold、Carbon INK | |
| Registration (Min Space between PTH & Pattern) | 5.5mil | 4.5mil | |
| Registration For Reliability (Min Space between PTH & Pattern) | 6.5mil | 5.5mil | |
| Tolerance | Impedance | 10% | 8% | 
| Dimention | ±5mil | ±4mil | |
| Hole | PTH:±3mil NPTH:±2mil | PTH:±2mil NPTH:±2mil | |
高密度互連印刷電路板
| Character | |||
| Capability | Normal(MASS) | Limit(Sample) | |
| Layer Count | 6~14L | 18L | |
| Thickness | 0.5~1.5mm | 0.35~3.2mm | |
| Structure | Structure | 1+N+1、2+N+2、3+N+3、4+N+4、Any-layer(6~12L) | Any-layer(14~18L) | 
| μVIA Type | Stacked、Staggered | Skip via | |
| Plating Filled | dimple <25um | dimple <15um | |
| Lid plating(VIP) | dimple <50um | dimple <25um | |
| μVIA on PTH(VOP) | dimple <50um | dimple <25um | |
| Material | FR-4 | EM-370(5) | EM-370(D) | 
| TU-747T | TU-862T | ||
| S1150G | LSDI03K | ||
| EM-370(Z) | NPG-151 | ||
| Min Core | 2mil | 2mil | |
| Copper | Internal | 18um | 18um | 
| External | 30um | 25um | |
| VIA | Min Hole | 8mil | 6mil | 
| Min Pad | 18mil | 14mil | |
| Aspect Ratio | drill hole:8mil,A/R:5:1 drill hole:10mil,A/R:6:1 drill hole:>10mil,A/R:7:1 | drill hole:8mil,A/R:6:1 drill hole:10mil,A/R:6.5:1 drill hole:>10mil,A/R:7.5:1 | |
| Min Ring | 5mil | 4mil | |
| μVIA | Min Hole | 4mil | 3mil | 
| Min Capeture Pad | 10mil | 8mil | |
| Min Target Pad | 10mil | 8mil | |
| Aspect Ratio | <0.75 | <0.8 | |
| Min Ring | 3mil | 2.5mil | |
| Solder Mask | Color | Green、Bule、Black | Custom | 
| Min Web | 3mil/3mil&6mil | 2.5mil/2.5mil&4mil | |
| Min Clearance | 2mil | 1.5mil | |
| Min Coverage | 2.5mil/2.5mil&3mil | 1.8mil/1.8mil&2.5mil | |
| Legend | Color | White | White/Yellow/Black | 
| Min Width | 4mil | 3mil | |
| Matel Finished | OSP、IMAG、ENIG/ENIG+OSP 、Hard Gold、Carbon INK | OSP、IMAG、ENIG、ENIG+OSP 、Hard Gold、Carbon INK | |
| Registration (Min Space between PTH & Pattern) | 8mil | 6mil | |
| Tolerance | Impedance | ±10% | ±8% | 
| Dimention | ±5mil | ±4mil | |
| Hole | PTH:±3mil NPTH:±2mil | PTH:±2mil NPTH:±1.5mil | |
 
								